Difference between revisions of "APF27"
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All the i.MX27 peripherals (LCD, 2xSDIO, 3xSPI, 6xSerial, I2C, CSI, 3xUSB, keypad, PWM, etc...) and the FPGA signals can be accessed through two high density [[Hirose connectors]] like on the [[APF9328]] board. | All the i.MX27 peripherals (LCD, 2xSDIO, 3xSPI, 6xSerial, I2C, CSI, 3xUSB, keypad, PWM, etc...) and the FPGA signals can be accessed through two high density [[Hirose connectors]] like on the [[APF9328]] board. | ||
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| + | Link to the [http://www.armadeus.com/english/products-processor_boards-apf27.html product page] | ||
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| + | Link to the technical [http://www.armadeus.com/_downloads/apf27/ documentation ] | ||
[[Category:MainBoards]] | [[Category:MainBoards]] | ||
Revision as of 19:43, 2 March 2009
The APF27 is the future main board which is currently developped by Armadeus Systems.
This product is a middle/high-end Single Board Computer targeted for low power applications and extended connectivity.
Here is a list of the main features:
- Processor: Freescale i.MX27 (ARM9 @ 400MHz)
- RAM: Mobile DDR. 64 to 256MB. 32 bits data bus. Default capacity will be either 64 or 128MB.
- Flash: Mobile NAND. 256MB, 16 bits data bus.
- Ethernet: onboard Physical (ready to use Ethernet 10/100Mbit link)
- USB: High speed USB OTG (OnTheGo) with onboard Physical (ready to use USB OTG link)
- RS232: onboard Physical (RS232 compatible interface)
- FPGA: Xilinx Spartan 3A (50 to 400k gates, 200k default)
- Supplies: high end DC/DC converters and LDOs on board. Only one external supply from 3.3 to 5V required.
- Low power sleep mode (<10mW)
- Mechanical dimensions: ~60x45mm
All the i.MX27 peripherals (LCD, 2xSDIO, 3xSPI, 6xSerial, I2C, CSI, 3xUSB, keypad, PWM, etc...) and the FPGA signals can be accessed through two high density Hirose connectors like on the APF9328 board.
Link to the product page
Link to the technical documentation
